US chip gear giant launches initiative in
Singapore for power-efficient AI data centres
- Applied Materials introduced the Epic Advanced Packaging Platform in Singapore to promote collaboration in semiconductor chip packaging technologies
- The platform aims to develop advanced packaging solutions to improve energy efficiency, addressing the rising energy demands driven by AI workloads
- Over 24 R&D leaders gathered to co-develop packaging technologies, focusing on reducing costs, risks, and development time
- The initiative aligns with Singapore’s Research, Innovation, and Enterprise 2025 strategy, boosting its semiconductor ecosystem
- Singapore is investing $180 million in a centre to support semiconductor R&D, prototyping, and manufacturing, enhancing its role in the global supply chain
Applied Materials, a leading US maker of chip-manufacturing equipment, has launched the Epic Advanced Packaging Platform in Singapore to boost collaboration across the semiconductor industry. This initiative brings together equipment makers, material suppliers, device companies, and research institutes to accelerate the development of advanced chip-packaging technologies aimed at improving energy efficiency in computing. With growing AI and generative AI (GenAI) workloads straining global data centre power grids, these technologies are critical for managing rising energy demands, which are expected to increase by 160% by 2026.
Advanced chip packaging, which combines separate chips for better efficiency, is seen as a key solution. However, its complexity requires close collaboration to reduce risks, costs, and development time. At a recent summit in Singapore, over 24 R&D leaders gathered to kickstart the initiative, focusing on co-developing foundational packaging technologies. Singapore’s Deputy Prime Minister Gan Kim Yong highlighted how the platform aligns with the country’s Research, Innovation, and Enterprise 2025 strategy and will strengthen its semiconductor ecosystem. Local companies like ACE United Technologies and PBA Group, which specialize in precision engineering and motion control, stand to benefit. The initiative will also enrich Singapore’s research capabilities, giving researchers early access to industry insights and practical experience.
Singapore is further supporting this effort with a $180 million National Semiconductor Translation and Innovation Centre to aid R&D, prototyping, and small-scale manufacturing. The Epic Platform also ties into Applied Materials’ global strategy, which includes a new centre in Silicon Valley, California. With Singapore already producing one in 10 chips and one in five semiconductor equipment pieces globally, this initiative cements its role as a key player in the global semiconductor supply chain while driving innovation and collaboration.
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